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产品信息特性
All other trademarks are the property of their respective owners DESCRIPTION/ORDERING INFORMATIONThis JEDEC SSTE32882-compliant, 28-bit 1:2 or 26-bit 1:2 and 4-bit 1:1 registering clock driver with parity is designed for operation on DDR3 Registered DIMMs up to DDR3-1333 with VDD of 1.5 V. All inputs are 1.5-V, CMOS-compatible. All outputs are 1.5-V CMOS drivers optimized to drive DRAM signals on terminated traces in DDR3 RDIMM applications. Clock outputs Yn and Yn and control net outputs DxCKEn, DxCSn, and DxODTn can each be driven with a different strength and skew to optimize signal integrity, compensate for different loading, and balance signal travel speed. The SN74SSQE32882 has two basic modes of operation associated with the Quad Chip Select Enable (QCSEN) input. First, when the QCSEN input pin is open or pulled high, the component has two chip select inputs, DCS0 and DCS1, and two copies of each chip select output, QACS0, QACS1, QBCS0 and QBCS1. This mode is the QuadCS disabled mode. Alternatively, when the QCSEN input pin is pulled low, the component has four chip select inputs DCS[3:0], and four chip select outputs, QCS[3:0]. This mode is the QuadCS enabled mode. When QCSEN is high or floating, the device also supports an operating mode that allows a single device to be mounted on the back side of a DIMM array. This device can then be configured to keep the input bus termination (IBT) feature enabled for all input signals independent of MIRROR. The SN74SSQE32882. operates from a differential clock (CK and CK). Data are registered at the crossing of CK going high and CK going low. This data can either be re-driven to the outputs or used to access internal control registers. Details are covered in the Function Tables (each flip-flop) with QCSEN = low. Input bus data integrity is protected by a parity function. All address and command input signals are summed; the last bit of the sum is then compared to the parity signal delivered by the system at the PAR_IN input one clock cycle later. If these two values do not match, the device pulls the open drain output ERROUT low. The control signals (DCKE0, DCKE1, DODT0, DODT1, and DCS[n:0]) are not part of this computation. The SN74SSQE32882 implements different power-saving mechanisms to reduce thermal power dissipation and to support system power-down states. Power consumption is further reduced by disabling unused outputs. The package design is optimal for high-density DIMMs. By aligning input and output positions towards DIMM finger-signal ordering and SDRAM ballout, the device de-scrambles the DIMM traces and allows low crosstalk designs with low interconnect latency. Edge-controlled outputs reduce ringing and improve signal eye opening at the SDRAM inputs. |
| 价格(美元) | 封装 | 样片 | ||||
| 器件 | 状态 | 温度 (oC) | 价格(美元) | Quantity | 封装 | 引脚 | 封装数量 | 封装载体 | 样片 |
| SN74SSQE32882ZALR | ACTIVE | 0 to 85 | 5.90 | 1ku | BGA (ZAL) | 176 | 1000 | LARGE T&R | 请与TI分销商或销售办事处联系申请样片 |
| SN74SSQE32882ZCJR | ACTIVE | 0 to 85 | 5.90 | 1ku | BGA (ZCJ) | 176 | 1000 | LARGE T&R | 请与TI分销商或销售办事处联系申请样片 |
建议零售价格仅用于预算,以美元为单位,并且价格是浮动的。 若要查询有关批量价格、本地货币价格或交付报价的信息,请与当地德州仪器 (TI) 销售办事处或授权经销商联系。
| TI 库存状态 | 已报告的分销商库存 | |||||||
| SN74SSQE32882ZALR | 截至 10:13 PM GMT, 2009年 7月 2日 | 截至 10:13 PM GMT, 2009年 7月 2日 | ||||||
| 交货周期 | 地区 | 公司 | 库存 | 采购 | ||||
| 10 Weeks | 无报告 查看经销商 | |||||||
| SN74SSQE32882ZCJR | 截至 10:13 PM GMT, 2009年 7月 2日 | 截至 10:13 PM GMT, 2009年 7月 2日 | ||||||
| 交货周期 | 地区 | 公司 | 库存 | 采购 | ||||
| 4 Weeks | 无报告 查看经销商 | |||||||
| 查看中国经销商 | ||||||||
**目前尚无法提供交货时间信息。 但是,由于我们的信息每天都会更新,如有疑问,请马上与我们联系。 有关附加信息,请与首选的 TI 授权分销商 联系。
| 产品目录 | DPPM / MTBF / FIT 率 | ||||
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 详细信息 | 详细信息 |
| SN74SSQE32882ZALR | Green (RoHS & no Sb/Br) | SNAGCU | Level-3-260C-168 HR | 查看 | 查看 |
| SN74SSQE32882ZCJR | Green (RoHS & no Sb/Br) | SNAGAU | Level-3-260C-168 HR | 查看 | 查看 |
* 计划的环保分级:无铅 (RoHS)、无铅(RoHS 豁免)或绿色环保(RoHS 和无 Sb/Br)- 请单击上表中产品目录明细的“查看”链接,以获得最新供货信息和附加产品目录明细。
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