TPS2835

正在供货

具有 TTL 输入和使能功能、用于反相同步降压的 2.4A、28V 半桥栅极驱动器

产品详情

Bootstrap supply voltage (max) (V) 28 Power switch MOSFET Input supply voltage (min) (V) 4.5 Input supply voltage (max) (V) 15 Peak output current (A) 2.4 Operating temperature range (°C) -40 to 125 Rating Catalog Propagation delay time (µs) 0.07 Rise time (ns) 50 Fall time (ns) 40 Iq (mA) 3 Input threshold TTL Channel input logic TTL Switch node voltage (V) 0 Features Dead time control, Enable, Synchronous Rectification Driver configuration Inverting
Bootstrap supply voltage (max) (V) 28 Power switch MOSFET Input supply voltage (min) (V) 4.5 Input supply voltage (max) (V) 15 Peak output current (A) 2.4 Operating temperature range (°C) -40 to 125 Rating Catalog Propagation delay time (µs) 0.07 Rise time (ns) 50 Fall time (ns) 40 Iq (mA) 3 Input threshold TTL Channel input logic TTL Switch node voltage (V) 0 Features Dead time control, Enable, Synchronous Rectification Driver configuration Inverting
HTSSOP (PWP) 14 32 mm² 5 x 6.4 SOIC (D) 14 51.9 mm² 8.65 x 6
  • Floating Bootstrap or Ground-Reference High-Side Driver
  • Adaptive Dead-Time Control
  • 50-ns Max Rise/Fall Times With 3.3-nF Load
  • 2.4-A Typical Output Current
  • 4.5-V to 15-V Supply Voltage Range
  • TTL-Compatible Inputs
  • Internal Schottky Bootstrap Diode
  • SYNC Control for Synchronous or Nonsynchronous Operation
  • CROWBAR for OVP, Protects Against Faulted High-Side Power FETs
  • Low Supply Current....3 mA Typical
  • Ideal for High-Current Single or Multiphase Power Supplies
  • –40°C to 125°C Operating Virtual Junction Temperature Range
  • Available in SOIC and TSSOP PowerPAD Packages

PowerPAD is a trademark of Texas Instruments Incorporated.

  • Floating Bootstrap or Ground-Reference High-Side Driver
  • Adaptive Dead-Time Control
  • 50-ns Max Rise/Fall Times With 3.3-nF Load
  • 2.4-A Typical Output Current
  • 4.5-V to 15-V Supply Voltage Range
  • TTL-Compatible Inputs
  • Internal Schottky Bootstrap Diode
  • SYNC Control for Synchronous or Nonsynchronous Operation
  • CROWBAR for OVP, Protects Against Faulted High-Side Power FETs
  • Low Supply Current....3 mA Typical
  • Ideal for High-Current Single or Multiphase Power Supplies
  • –40°C to 125°C Operating Virtual Junction Temperature Range
  • Available in SOIC and TSSOP PowerPAD Packages

PowerPAD is a trademark of Texas Instruments Incorporated.

The TPS2834 and TPS2835 are MOSFET drivers for synchronous-buck power stages. These devices are ideal for designing a high-performance power supply using switching controllers that do not include on-chip MOSFET drivers. The drivers are designed to deliver minimum 2-A peak currents into large capacitive loads. The high-side driver can be configured as ground-reference or as floating-bootstrap. An adaptive dead-time control circuit eliminates shoot-through currents through the main power FETs during switching transitions, and provides high efficiency for the buck regulator. The TPS2834 and TPS2835 have additional control functions: ENABLE, SYNC, and CROWBAR. Both high-side and low-side drivers are off when ENABLE is low. The driver is configured as a nonsynchronous-buck driver disabling the low-side driver when SYNC is low. The CROWBAR function turns on the low-side power FET, overriding the IN signal, for overvoltage protection against faulted high-side power FETs.

The TPS2834 has a noninverting input, while the TPS2835 has an inverting input. These drivers are available n 14-terminal SOIC and thermally enhanced TSSOP PowerPAD™ packages and operate over a junction temperature range of –40°C to 125°C.

The TPS2834 and TPS2835 are MOSFET drivers for synchronous-buck power stages. These devices are ideal for designing a high-performance power supply using switching controllers that do not include on-chip MOSFET drivers. The drivers are designed to deliver minimum 2-A peak currents into large capacitive loads. The high-side driver can be configured as ground-reference or as floating-bootstrap. An adaptive dead-time control circuit eliminates shoot-through currents through the main power FETs during switching transitions, and provides high efficiency for the buck regulator. The TPS2834 and TPS2835 have additional control functions: ENABLE, SYNC, and CROWBAR. Both high-side and low-side drivers are off when ENABLE is low. The driver is configured as a nonsynchronous-buck driver disabling the low-side driver when SYNC is low. The CROWBAR function turns on the low-side power FET, overriding the IN signal, for overvoltage protection against faulted high-side power FETs.

The TPS2834 has a noninverting input, while the TPS2835 has an inverting input. These drivers are available n 14-terminal SOIC and thermally enhanced TSSOP PowerPAD™ packages and operate over a junction temperature range of –40°C to 125°C.

下载 观看带字幕的视频 视频

技术文档

star =有关此产品的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 8
类型 标题 下载最新的英语版本 日期
* 数据表 Synchronous-Buck MOSFET Drivers With Deadtime Control 数据表 (Rev. B) 2002年 8月 13日
应用简报 了解峰值源电流和灌电流 (Rev. A) 英语版 (Rev.A) 2020年 4月 29日
应用简报 适用于栅极驱动器的外部栅极电阻器设计指南 (Rev. A) 英语版 (Rev.A) 2020年 4月 29日
应用手册 Optimizing MOSFET Characteristics by Adjusting Gate Drive Amplitude (Rev. A) 2018年 11月 14日
更多文献资料 Fundamentals of MOSFET and IGBT Gate Driver Circuits (Replaces SLUP169) (Rev. A) 2018年 10月 29日
选择指南 电源管理指南 2018 (Rev. K) 2018年 7月 31日
选择指南 电源管理指南 2018 (Rev. R) 2018年 6月 25日
更多文献资料 MOSFET 和 IGBT 栅极驱动器电路的基本原理 最新英语版本 (Rev.A) 2018年 4月 17日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

仿真模型

TPS2835 PSpice Transient Model

SLVM632.ZIP (75 KB) - PSpice Model
仿真模型

TPS2835 Unencrypted PSpice Transient Model

SLVMB94.ZIP (3 KB) - PSpice Model
模拟工具

PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®

PSpice® for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence® 的模拟分析引擎。PSpice for TI 可免费使用,包括业内超大的模型库之一,涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。

在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
封装 引脚 下载
HTSSOP (PWP) 14 查看选项
SOIC (D) 14 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

视频