产品详情

Technology family TXS Applications MMC, SD Card, SDIO Rating Catalog Operating temperature range (°C) -40 to 85
Technology family TXS Applications MMC, SD Card, SDIO Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFP) 20 3.96 mm² 1.8 x 2.2
  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
    • Fast Propagation Delay (4 ns Max When Translating
      Between 1.8 V and 3 V)
  • Integrated EMI Filtering and ESD Protection Circuitry
  • ESD Protection Exceeds JESD 22 (A Port)
    • 2500-V Human-Body Model (A114-B)
    • 250-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)
  • ±8-kV Contact Discharge IEC 61000-4-2 ESD (B-port)

All other trademarks are the property of their respective owners.

  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
    • Fast Propagation Delay (4 ns Max When Translating
      Between 1.8 V and 3 V)
  • Integrated EMI Filtering and ESD Protection Circuitry
  • ESD Protection Exceeds JESD 22 (A Port)
    • 2500-V Human-Body Model (A114-B)
    • 250-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)
  • ±8-kV Contact Discharge IEC 61000-4-2 ESD (B-port)

All other trademarks are the property of their respective owners.

The TXS0206 is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It includes a high-speed level translator along with ESD protection and EMI filtering circuitry.

The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206 enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.

Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206 incorporates ±8-kV Contact Discharge protection on the card side.

The TXS0206 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206 an ideal choice for these applications.

The TXS0206 is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It includes a high-speed level translator along with ESD protection and EMI filtering circuitry.

The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206 enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.

Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206 incorporates ±8-kV Contact Discharge protection on the card side.

The TXS0206 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206 an ideal choice for these applications.

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类型 标题 下载最新的英语版本 日期
* 数据表 TXS0206 MMC, SD Card, Memory Stick(TM) Voltage-Translation Transceiver 数据表 (Rev. C) 2010年 1月 6日
应用手册 SDIO 的电压转换 PDF | HTML 英语版 PDF | HTML 2022年 5月 19日
选择指南 Voltage Translation Buying Guide (Rev. A) 2021年 4月 15日
更多文献资料 Voltage-Level Translation Guide (Rev. H) 2015年 8月 31日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

仿真模型

TXS0206A IBIS Model

SCEM551.ZIP (367 KB) - IBIS Model
封装 引脚 下载
DSBGA (YFP) 20 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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