质量、可靠性、封装及环保信息

清晰的 gif 图片

德州仪器 (TI) 质量策略


新技术正致力于提高芯片在从太空到人体的各种环境中的性能。

这些复杂的系统需要一个专为此使命而设计的可靠且经济高效的封装。

TI 将封装技术与设计、材料、装配工艺、成本效益、质量和容量相结合,使我们的客户可以从他们的创新中获得最多价值。

可靠性数据

 · 可靠性评估器 (DPPM/MTBF/FIT)

 · 可燃性


工艺和方法

 · 质量体系手册

 · 品质和可靠性手册

 · 鉴定过程

 · 统计过程控制

 · 产品变更通知

 · 相似性对照表

 · EVM user’s guide update/addendum pdf logo


封装信息

 · 封装信息

 · 潮湿敏感度搜索

 · Surface Mount Package Removal Application Note Surface Mount Package Removal Application Note

环保信息与无铅 (Pb-free)

 · 状况对照表

 · 目录和计划搜索

 · 包装

 · 一般信息

 · 无铅 (Pb-free)


扩展保存期

 · 更改描述

 · 器件搜索

 · 长期存储器可靠性手册 pdf logo

 · 常见问题解答


质量资源

 · 认证

 · 行业标准

 · 美国国家半导体质量信息

NOTE: Texas Instruments has purchased National Semiconductor. As of September 23, 2011 and until further notice, products sold or advertised under the National Semiconductor name or logo, and information, support and interactions concerning such products, remain subject to the preexisting National Semiconductor standard terms and conditions of sale, terms of use of website, and Notices (and/or terms previously agreed in writing with National Semiconductor, where applicable) and are not subject to any differing terms and notices applicable to other TI components, sales or websites. To the extent information on official TI and National websites and business social networking media, etc., pertains to both TI and National-branded products, both companies' instructions, warnings and limitations in the above-referenced terms of use apply.