TMS320LBC53S
- Powerful 16-Bit TMS320C5x CPU
- 20-, 25-, 35-, and 50-ns Single-Cycle Instruction Execution Time for 5-V Operation
- 25-, 40-, and 50-ns Single-Cycle Instruction Execution Time for 3-V Operation
- Single-Cycle 16 × 16-Bit Multiply/Add
- 224K × 16-Bit Maximum Addressable External Memory Space (64K Program, 64K Data, 64K I/O, and 32K Global)
- 2K, 4K, 8K, 16K, 32K × 16-Bit Single-Access On-Chip Program ROM
- 1K, 3K, 6K, 9K × 16-Bit Single-Access On-Chip Program/ Data RAM (SARAM)
- 1K Dual-Access On-Chip Program/ Data RAM (DARAM)
- Full-Duplex Synchronous Serial Port for Coder/Decoder Interface
- Time-Division-Multiplexed (TDM) Serial Port
- Hardware or Software Wait-State Generation Capability
- On-Chip Timer for Control Operations
- Repeat Instructions for Efficient Use of Program Space
- Buffered Serial Port
- Host Port Interface
- Multiple Phase-Locked Loop (PLL) Clocking Options (×1, ×2, ×3, ×4, ×5, ×9 Depending on Device)
- Block Moves for Data/Program Management
- On-Chip Scan-Based Emulation Logic
- Boundary Scan
- Five Packaging Options
- 100-Pin Quad Flat Package (PJ Suffix)
- 100-Pin Thin Quad Flat Package (PZ Suffix)
- 128-Pin Thin Quad Flat Package (PBK Suffix)
- 132-Pin Quad Flat Package (PQ Suffix)
- 144-Pin Thin Quad Flat Package (PGE Suffix)
- Low Power Dissipation and Power-Down Modes:
- 47 mA (2.35 mA/ MIP) at 5 V, 40-MHz Clock (Average)
- 23 mA (1.15 mA/ MIP) at 3 V, 40-MHz Clock (Average)
- 10 mA at 5 V, 40-MHz Clock (IDLE1 Mode)
- 3 mA at 5 V, 40-MHz Clock (IDLE2 Mode)
- 5 mA at 5 V, Clocks Off (IDLE2 Mode)
- High-Performance Static CMOS Technology
- IEEE Standard 1149.1 Test-Access Port (JTAG)
TI is a trademark of Texas Instruments Incorporated.
IEEE Standard 1149.1\x961990, IEEE Standard Test-Access Port and Boundary-Scan Architecture.
References to 'C5x in this document include both TMS320C5x and TMS320LC5x devices unless specified otherwise.
The TMS320C5x generation of the Texas Instruments (TI™) TMS320 digital signal processors (DSPs) is fabricated with static CMOS integrated circuit technology; the architectural design is based upon that of an earlier TI DSP, the TMS320C25. The combination of advanced Harvard architecture, on-chip peripherals, on-chip memory, and a highly specialized instruction set is the basis of the operational flexibility and speed of the 'C5x devices. They execute up to 50 million instructions per second (MIPS).
The 'C5x devices offer these advantages:
Table 1 provides a comparison of the devices in the 'C5x generation. It shows the capacity of on-chip RAM and ROM memories, number of serial and parallel I/O ports, execution time of one machine cycle, and type of package with total pin count.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | Digital Signal Processors 数据表 (Rev. A) | 1996年 4月 1日 | |||
用户指南 | TMS320C5x Evaluation Module Installation Guide (Rev. C) | 1996年 9月 1日 | ||||
应用手册 | Improving 32-Channel DTMF Decoders in PBX Systems Using the TMS320C5x DSP | 1996年 6月 1日 | ||||
用户指南 | TMS320C5x DSP Starter Kit User's Guide (Rev. A) | 1996年 6月 1日 | ||||
应用手册 | Use of the TMS320C5x Internal Oscillator With External Crystals or Resonators | 1995年 7月 1日 | ||||
应用手册 | A PCMCIA TMS320 DSP MediaCard for Sound and Fax/Modem Applications | 1995年 3月 1日 | ||||
用户指南 | TMS320C5x Emulator Installation Guide (Rev. B) | 1994年 12月 1日 | ||||
应用手册 | Setting Up TMS320 DSP Interrupts in 'C' | 1994年 11月 1日 | ||||
应用手册 | Minimizing Quantization Effects Using the TMS320 DSP Family | 1994年 7月 1日 | ||||
应用手册 | Telecommunications Applications With the TMS320C5x | 1994年 3月 1日 | ||||
用户指南 | TMS320C5x C Source Debugger User's Guide (Rev. B) | 1994年 2月 1日 | ||||
应用手册 | Calculation Of TMS320C5x Power Dissipation | 1993年 4月 1日 | ||||
用户指南 | Parallel Debug Mgr Addendum to TMS320C4x & TMS320C5x C Source Debugger UGs | 1993年 4月 1日 |
设计和开发
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搜索工具按产品类型划分为以下类别:
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- 操作系统包括 TI 处理器支持的操作系统。
- 应用软件是指应用特定的软件,包括在 TI 处理器上运行的中间件和库。
- SoM 是模块上系统解决方案
封装 | 引脚 | 下载 |
---|---|---|
LQFP (PZ) | 100 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点